Authorship: Ramírez D., Romero D., Via J., Lopez-Valcarce R., Santamaria I.,
Fuente: IEEE Transactions on Signal Processing, 2018, 66(23), 6268-6280
Publisher: Institute of Electrical and Electronics Engineers Inc.
Publication date: 01/12/2018
No. of pages: 13
Publication type: Article
DOI: 10.1109/TSP.2018.2875884
ISSN: 1053-587X,1941-0476
Spanish project: TEC2015-69648-REDC ; TEC2016-81900-REDT/AEI ; TEC2015-69868-C2-1-R ; TEC2016-76409-C2-2-R ; TEC2016-75067-C4-4-R ; TEC2017-86921-C2-1-R ; TEC2017-86921-C2-2-R
Publication Url: https://doi.org/10.1109/TSP.2018.2875884