Authorship: Aja B., Schuster K., Schäfer F., Gallego J., Chartier S., Seelmann-Eggebert M., Kallfass I., Leuther A., Massler H., Schlechtweg M., Diez C., López-Fernandez I., Lenz S., Türk S.,
Fuente: IEEE Microwave and Wireless Components Letters, 2011, 21(11), 613-615
Publisher: Institute of Electrical and Electronics Engineers Inc.
Publication date: 01/11/2011
No. of pages: 3
Publication type: Article
DOI: 10.1109/LMWC.2011.2167502
ISSN: 1531-1309,1558-1764
Publication Url: https://doi.org/10.1109/LMWC.2011.2167502