Authorship: Perez J., Via J., Vielva L., Ramirez D.,
Fuente: IEEE Transactions on Wireless Communications, 2022, 21(4), 2521-2533
Publisher: Institute of Electrical and Electronics Engineers Inc.
Publication date: 01/04/2022
No. of pages: 13
Publication type: Article
DOI: 10.1109/TWC.2021.3113089
ISSN: 1536-1276
Spanish project: TEC2017-86921-C2-1-R
Publication Url: https://doi.org/10.1109/TWC.2021.3113089