Authorship: Suarez D., Fernandez V., Posadas H., Sanchez P.,
Fuente: IEEE Embedded Systems Letters, 2023, 15(3), 157-160
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Publication date: 01/09/2023
No. of pages: 4
Publication type: Article
DOI: 10.1109/LES.2022.3218289
ISSN: 1943-0663,1943-0671
Spanish project: PID2020-116417RB-C43
European project: info:eu-repo/grantAgreement/EC/H2020/101007273/EU/Distributed Artificial Intelligent Systems/DAIS/
Publication Url: https://doi.org/10.1109/LES.2022.3218289