Authorship: Oria C., Ortiz A., Ferreño D., Carrascal I., Fernández I.,
Fuente: IEEE Transactions on Dielectrics and Electrical Insulation, 2019, 26(3), 939-954
Publisher: Institute of Electrical and Electronics Engineers Inc.
Publication date: 01/06/2019
No. of pages: 16
Publication type: Article
DOI: 10.1109/TDEI.2019.8726044
ISSN: 1558-4135,1070-9878
Spanish project: DPI2013-43897-P
Publication Url: https://doi.org/10.1109/TDEI.2019.007896