Authorship: Bruch D., Amils R., Gallego J., Seelmann-Eggebert M., Aja B., Schäfer F., Diez C., Leuther A., Schlechtweg M., Ambacher O., Kallfass I.,
Fuente: IEEE Microwave and Wireless Components Letters, 2012, 22(12), 657-659
Publisher: Institute of Electrical and Electronics Engineers Inc.
Publication date: 01/12/2012
No. of pages: 3
Publication type: Article
DOI: 10.1109/LMWC.2012.2228176
ISSN: 1531-1309,1558-1764
Publication Url: https://doi.org/10.1109/LMWC.2012.2228176