Authorship: Leon A., Casanueva A., Cagigas J., Mediavilla A.,
Fuente: IEEE Latin America Transactions, 2012, 10(2), 1445-1451
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Publication date: 01/03/2012
No. of pages: 7
Publication type: Article
DOI: 10.1109/TLA.2012.6187585
ISSN: 1548-0992
Spanish project: TEC2008-06684-C03-01
Publication Url: https://doi.org/10.1109/TLA.2012.6187585