Authorship: Soleymani M., Santamaria I., Jorswieck E., Rezvani S.,
Fuente: IEEE Transactions on Signal Processing, 2023, 71, 963-978
Publisher: Institute of Electrical and Electronics Engineers, Inc.
Publication date: 20/03/2023
No. of pages: 16
Publication type: Article
DOI: 10.1109/TSP.2023.3259145
ISSN: 1053-587X,1941-0476
Spanish project: PID2019-104958RB-C43
Publication Url: http://doi.org/10.1109/TSP.2023.3259145