Authorship: Garg V., Santamaria I., Ramirez D., Scharf L.,
Fuente: IEEE Transactions on Signal Processing, 2019, 67(11), 3028-3041
Publisher: Institute of Electrical and Electronics Engineers Inc.
Publication date: 01/06/2019
No. of pages: 14
Publication type: Article
DOI: 10.1109/TSP.2019.2912151
ISSN: 1053-587X,1941-0476
Spanish project: TEC2016-75067-C4-4-R ; TEC2015-69648-REDC ; TEC2017-92552-EXP ; TEC2015-69868-
C2-1-R ; TEC2017-86921-C2-2-R
Publication Url: https://doi.org/10.1109/TSP.2019.2912151