Authorship: Santamaria I., Scharf L., Via J., Wang H., Wang Y.,
Fuente: IEEE Transactions on Signal Processing, 2017, 65(20), 5266-5280
Publisher: Institute of Electrical and Electronics Engineers Inc.
Publication date: 15/10/2017
No. of pages: 15
Publication type: Article
DOI: 10.1109/TSP.2017.2723340
ISSN: 1053-587X,1941-0476
Spanish project: TEC2013-47141-C4-3-R ; TEC2016-75067-C4-4-R ; TEC2016-81900-REDT
Publication Url: https://doi.org/10.1109/TSP.2017.2723340