Authorship: Ardila V., Ramirez F., Suarez A.,
Fuente: IEEE Microwave and Wireless Components Letters, 2022, 32(6), 740-743
Publisher: Institute of Electrical and Electronics Engineers Inc.
Publication date: 01/06/2022
No. of pages: 4
Publication type: Article
DOI: 10.1109/LMWC.2022.3163605
ISSN: 1531-1309,1558-1764
Spanish project: TEC2017-88242-C3-1-R
Publication Url: https://doi.org/10.1109/LMWC.2022.3163605