Authorship: Pereda J., Grande A.,
Fuente: IEEE Microwave and Wireless Components Letters, 2018, 28(6), 461-463
Publisher: Institute of Electrical and Electronics Engineers Inc.
Publication date: 01/06/2018
No. of pages: 3
Publication type: Article
DOI: 10.1109/LMWC.2018.2832014
ISSN: 1531-1309,1558-1764
Spanish project: TEC2014-55463-C3-2-P
; TEC2014-55463-C3-3-P
Publication Url: https://doi.org/10.1109/LMWC.2018.2832014